Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Wedi'i Gadw mewn:
Manylion Llyfryddiaeth
Awduron Corfforaethol: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Winter Meeting
Awduron Eraill: Engel, Peter A., Chen, W. T., Jahsman, W. E. (William E.)
Fformat: Llyfr
Iaith:English
Cyhoeddwyd: New York, N.Y. : The Society, c1991.
Cyfres:AMD (Series) ; v. 131.
EEP (Series) ; vol. 1.
Pynciau:
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.
Disgrifiad
Disgrifiad Corfforoll:v, 153 p. : ill. ; 28 cm.
Llyfryddiaeth:Includes bibliographical references and index.
ISBN:0791808963

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