Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Samankaltaisia teoksia

• Thermal stress and strain in microelectronics packaging /
  Julkaistu: (1993)
• Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
  Julkaistu: (1996)
• Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /
  Julkaistu: (1991)
• Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A. /
  Julkaistu: (1988)
• Microelectronics packaging handbook /
  Julkaistu: (1997)