Toon 1 - 14 resultaten van 14 Voor zoekopdracht 'American Society of Mechanical Engineers. Electrical and Electronic Packaging Division', zoektijd: 0,02s Verfijn jouw resultaten
  1. 1
    CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
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    Gepubliceerd in 1994
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  2. 2
    Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
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    Gepubliceerd in 1996
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  3. 3
    Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
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    Gepubliceerd in 1996
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  4. 4
    Structural analysis in microelectronics and fiber optics, 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
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    Gepubliceerd in 1994
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  5. 5
    Structural analysis in microelectronics and fiber optics, 1996 : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
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    Gepubliceerd in 1996
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  6. 6
    Structural analysis in microelectronics and fiber optics : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /
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    Gepubliceerd in 1993
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  7. 7
    Computer aided design in electronic packaging /
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    Gepubliceerd in 1992
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  8. 8
    Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /
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    Gepubliceerd in 1993
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  9. 9
    Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /
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    Gepubliceerd in 1995
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  10. 10
    Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
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    Gepubliceerd in 1995
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  11. 11
    Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
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    Gepubliceerd in 1991
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  12. 12
    Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /
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    Gepubliceerd in 1993
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  13. 13
    Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 /
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    Gepubliceerd in 1992
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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  14. 14
    Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
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    Gepubliceerd in 1995
    “…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
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