Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

محفوظ في:
التفاصيل البيبلوغرافية
مؤلفون مشاركون: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Winter Meeting
مؤلفون آخرون: Engel, Peter A., Chen, W. T., Jahsman, W. E. (William E.)
التنسيق: كتاب
اللغة:English
منشور في: New York, N.Y. : The Society, c1991.
سلاسل:AMD (Series) ; v. 131.
EEP (Series) ; vol. 1.
الموضوعات:
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.
الوصف
وصف مادي:v, 153 p. : ill. ; 28 cm.
بيبلوغرافيا:Includes bibliographical references and index.
ردمك:0791808963

مواد مشابهة