CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

Eitemau Tebyg

• Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
  Cyhoeddwyd: (1996)
• Heat transfer enhancement in electronics cooling : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
  Cyhoeddwyd: (1991)
• Current trends in protective packaging of computers and electronic components /
  Cyhoeddwyd: (1988)
• Heat transfer in electronic and microelectronic equipment /
  Cyhoeddwyd: (1990)
• Heat transfer in electronic equipment, 1983 : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Boston, Massachusetts, November 13-18, 1983 /
  Cyhoeddwyd: (1983)