Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

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Detaylı Bibliyografya
Yazar: Lau, John H.
Materyal Türü: Kitap
Dil:English
Baskı/Yayın Bilgisi: New York ; London : McGraw-Hill, c2000.
Seri Bilgileri:McGraw-Hill professional engineering
Konular:
Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
Online Erişim:Table of contents
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Table of contents
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