Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

Spremljeno u:
Bibliografski detalji
Glavni autor: Lau, John H.
Format: Knjiga
Jezik:English
Izdano: New York ; London : McGraw-Hill, c2000.
Serija:McGraw-Hill professional engineering
Teme:
Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
Online pristup:Table of contents
Publisher description
Contributor biographical information

Internet

Table of contents
Publisher description
Contributor biographical information

CARM 1 Store

Detalji primjeraka od CARM 1 Store
Primjerak 1 Dostupno  Postavi narudžbu

Similar Items