Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

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Bibliographic Details
Main Author: Lau, John H.
Format: Book
Language:English
Published: New York ; London : McGraw-Hill, c2000.
Series:McGraw-Hill professional engineering
Subjects:
Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
Online Access:Table of contents
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Table of contents
Publisher description
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