Area array packaging processes for BGA, Flip Chip, and CSP /

Area array packaging processes for BGA, Flip Chip, and CSP /

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Bibliographic Details
Other Authors: Gilleo, Ken
Format: Book
Language:English
Published: New York ; London : McGraw-Hill, c2004.
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics)
Online Access:Contributor biographical information
Table of contents
Publisher description

Internet

Contributor biographical information
Table of contents
Publisher description

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