Area array packaging processes for BGA, Flip Chip, and CSP /

Area array packaging processes for BGA, Flip Chip, and CSP /

Saved in:
Bibliografiske detaljer
Andre forfattere: Gilleo, Ken
Format: Bog
Sprog:English
Udgivet: New York ; London : McGraw-Hill, c2004.
Fag:
Microelectronic packaging.
Multichip modules (Microelectronics)
Online adgang:Contributor biographical information
Table of contents
Publisher description

Internet

Contributor biographical information
Table of contents
Publisher description

CARM 1 Store

Detaljer om beholdninger fra CARM 1 Store
Kopi 1 Tilgængelig  Reservér”

Lignende værker