Area array packaging processes for BGA, Flip Chip, and CSP /
Gardado en:
| Outros autores: | |
|---|---|
| Formato: | Libro |
| Idioma: | English |
| Publicado: |
New York ; London :
McGraw-Hill,
c2004.
|
| Subjects: | |
| Acceso en liña: | Contributor biographical information Table of contents Publisher description |
| descrición da copia: | Formerly CIP. |
|---|---|
| Descrición Física: | x, 260 p. : ill. ; 25 cm. |
| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 0071428291 (acid-free paper) |