Area array packaging processes for BGA, Flip Chip, and CSP /
Sábháilte in:
| Rannpháirtithe: | |
|---|---|
| Formáid: | LEABHAR |
| Teanga: | English |
| Foilsithe / Cruthaithe: |
New York ; London :
McGraw-Hill,
c2004.
|
| Ábhair: | |
| Rochtain ar líne: | Contributor biographical information Table of contents Publisher description |
| Cur síos ar an mír: | Formerly CIP. |
|---|---|
| Cur síos fisiciúil: | x, 260 p. : ill. ; 25 cm. |
| Leabharliosta: | Includes bibliographical references and index. |
| ISBN: | 0071428291 (acid-free paper) |