Structural analysis in microelectronics and fiber optics, 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

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Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors: Suhir, Ephraim
Format: Conference Proceeding Book
Language:English
Published: New York : American Society of Mechanical Engineers, c1994.
Series:EEP (Series) ; vol. 8.
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Call Number: A3:AE37C0 F06608
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