Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /

פריטים דומים

• Area array packaging processes for BGA, Flip Chip, and CSP /
  יצא לאור: (2004)
• Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
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  יצא לאור: (2000)
• Thermal management handbook : for electronic assemblies /
  מאת: Sergent, Jerry E.
  יצא לאור: (1998)
• Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
  יצא לאור: (1991)
• Thermal stress and strain in microelectronics packaging /
  יצא לאור: (1993)