Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Збережено в:
Бібліографічні деталі
Співавтори: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Winter Meeting
Інші автори: Engel, Peter A., Chen, W. T., Jahsman, W. E. (William E.)
Формат: Книга
Мова:English
Опубліковано: New York, N.Y. : The Society, c1991.
Серія:AMD (Series) ; v. 131.
EEP (Series) ; vol. 1.
Предмети:
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.

CARM 1 Store

Детальна інфо про примірники із CARM 1 Store
Шифр: A3:AE23C0 F06335
Примірник 1 Доступно  Розмістити замовлення

Схожі ресурси