Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

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Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Winter Meeting
Other Authors: Engel, Peter A., Chen, W. T., Jahsman, W. E. (William E.)
Format: Book
Language:English
Published: New York, N.Y. : The Society, c1991.
Series:AMD (Series) ; v. 131.
EEP (Series) ; vol. 1.
Subjects:
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.

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