Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

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書目詳細資料
Corporate Authors: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Winter Meeting
其他作者: Engel, Peter A., Chen, W. T., Jahsman, W. E. (William E.)
格式: 圖書
語言:English
出版: New York, N.Y. : The Society, c1991.
叢編:AMD (Series) ; v. 131.
EEP (Series) ; vol. 1.
主題:
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.
實物特徵
實物描述:v, 153 p. : ill. ; 28 cm.
參考書目:Includes bibliographical references and index.
ISBN:0791808963

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