Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
保存先:
| 共著者: | , , |
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| その他の著者: | , , |
| フォーマット: | 図書 |
| 言語: | English |
| 出版事項: |
New York, N.Y. :
The Society,
c1991.
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| シリーズ: | AMD (Series) ;
v. 131. EEP (Series) ; vol. 1. |
| 主題: |
| 物理的記述: | v, 153 p. : ill. ; 28 cm. |
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| 書誌: | Includes bibliographical references and index. |
| ISBN: | 0791808963 |