Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

שמור ב:
מידע ביבליוגרפי
Corporate Authors: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Winter Meeting
מחברים אחרים: Engel, Peter A., Chen, W. T., Jahsman, W. E. (William E.)
פורמט: ספר
שפה:English
יצא לאור: New York, N.Y. : The Society, c1991.
סדרה:AMD (Series) ; v. 131.
EEP (Series) ; vol. 1.
נושאים:
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.
תיאור
תיאור פיזי:v, 153 p. : ill. ; 28 cm.
ביבליוגרפיה:Includes bibliographical references and index.
ISBN:0791808963

פריטים דומים