Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /

Enregistré dans:
Détails bibliographiques
Collectivités auteurs: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Winter Meeting
Autres auteurs: Engel, Peter A., Chen, W. T., Jahsman, W. E. (William E.)
Format: Livre
Langue:English
Publié: New York, N.Y. : The Society, c1991.
Collection:AMD (Series) ; v. 131.
EEP (Series) ; vol. 1.
Sujets:
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.
Description
Description matérielle:v, 153 p. : ill. ; 28 cm.
Bibliographie:Includes bibliographical references and index.
ISBN:0791808963

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