Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /
Bewaard in:
Coauteurs: | , , |
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Andere auteurs: | , , |
Formaat: | Conferentie akten Boek |
Taal: | English |
Gepubliceerd in: |
New York, N.Y :
American Society of Mechanical Engineers,
c1995.
|
Reeks: | EEP (Series) ;
vol. 10. |
Onderwerpen: |
Fysieke beschrijving: | 2 v. (xvi, 1320 p.) : ill. ; 28 cm. |
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Bibliografie: | Includes bibliographical references and indexes. |
ISBN: | 0791813037 (set) |