Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /

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書目詳細資料
Corporate Authors: American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
其他作者: Pecht, Michael, Nguyen, Luu T.
格式: 圖書
語言:English
出版: New York : American Society of Mechanical Engineers, c1993.
叢編:EEP (Series) ; vol. 6.
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索引號: A1:AO02E0 F02138
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