Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /

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Korporace: American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Další autoři: Pecht, Michael, Nguyen, Luu T.
Médium: Kniha
Jazyk:English
Vydáno: New York : American Society of Mechanical Engineers, c1993.
Edice:EEP (Series) ; vol. 6.
Témata:

CARM 1 Store

Informace o exemplářích z: CARM 1 Store
Signatura: A1:AO02E0 F02138
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