Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /

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Bibliografski detalji
Autori kompanije: American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Daljnji autori: Pecht, Michael, Nguyen, Luu T.
Format: Knjiga
Jezik:English
Izdano: New York : American Society of Mechanical Engineers, c1993.
Serija:EEP (Series) ; vol. 6.
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