CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
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企業作者: | |
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其他作者: | , |
格式: | 圖書 |
語言: | English |
出版: |
New York :
American Society of Mechanical Engineers,
1994.
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叢編: | EEP (Series) ;
vol. 9. |
主題: |
CARM 1 Store
索引號: |
A1:AO02E0 F02138 |
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復印件 1 | 可用 預訂 |