CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

محفوظ في:
التفاصيل البيبلوغرافية
مؤلف مشترك: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
مؤلفون آخرون: Fulton, Robert E., Agonafer, D.
التنسيق: كتاب
اللغة:English
منشور في: New York : American Society of Mechanical Engineers, 1994.
سلاسل:EEP (Series) ; vol. 9.
الموضوعات:
Computer-aided engineering > Congresses.
Heat sinks (Electronics) > Congresses.
Heat > Transmission > Data processing > Congresses.
Electronic packaging > Design > Data processing > Congresses.
Electronic apparatus and appliances > Temperature control > Congresses.
الوصف
وصف مادي:v, 89 p. : ill. ; 28 cm.
بيبلوغرافيا:Includes bibliographical references.
ردمك:0791814602

مواد مشابهة