Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

সংরক্ষণ করুন:
গ্রন্থ-পঞ্জীর বিবরন
সংস্থা লেখক: American Society of Mechanical Engineers. Heat Transfer Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition
অন্যান্য লেখক: Amon, Cristina H.
বিন্যাস: কনফারেন্স প্রসিডিং গ্রন্থ
ভাষা:English
প্রকাশিত: New York : American Society of Mechanical Engineers, c1995.
মালা:HTD (Series) ; v. 319.
EEP (Series) ; v. 15.
বিষয়গুলি:
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245 0 0 |a Cooling and thermal design of electronic systems :  |b presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /  |c sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.]. 
260 |a New York :  |b American Society of Mechanical Engineers,  |c c1995. 
300 |a vi, 233 p. :  |b ill. ;  |c 28 cm. 
490 1 |a HTD ;  |v v. 319 
490 1 |a EEP ;  |v v. 15 
504 |a Includes bibliographical references and index. 
650 0 |a Electronic systems  |x Cooling  |v Congresses. 
650 0 |a Electronic apparatus and appliances  |x Cooling  |v Congresses. 
650 0 |a Electronic apparatus and appliances  |x Thermal properties  |v Congresses. 
700 1 |a Amon, Cristina H. 
710 2 |a American Society of Mechanical Engineers.  |b Heat Transfer Division 
710 2 |a American Society of Mechanical Engineers.  |b Electrical and Electronic Packaging Division. 
711 2 |a International Mechanical Engineering Congress and Exposition  |d (1995 :  |c San Francisco, Calif.) 
711 2 |a International Mechanical Engineering Congress and Exposition  |d (1995 :  |c San Francisco, Calif.) 
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830 0 |a HTD (Series) ;  |v v. 319. 
830 0 |a EEP (Series) ;  |v v. 15. 
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