Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
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| Hlavní autor: | |
|---|---|
| Médium: | Kniha |
| Jazyk: | English |
| Vydáno: |
New York ; London :
McGraw-Hill,
c2000.
|
| Edice: | McGraw-Hill professional engineering
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| Témata: | |
| On-line přístup: | Table of contents Publisher description Contributor biographical information |
| Fyzický popis: | xxii, 585 p. : ill. ; 24 cm. |
|---|---|
| Bibliografie: | Includes bibliographical references and index. |
| ISBN: | 0071351418 (hbk.) |