APA引文

Lau, J. H. (2000). Low cost flip chip technologies: For DCA, WLCSP, and PBGA assemblies. McGraw-Hill.

芝加哥风格引文

Lau, John H. Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies. New York ; London: McGraw-Hill, 2000.

MLA引文

Lau, John H. Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies. McGraw-Hill, 2000.