Dyfyniad APA

Lau, J. H. (2000). Low cost flip chip technologies: For DCA, WLCSP, and PBGA assemblies. McGraw-Hill.

Dyfyniad Arddull Chicago

Lau, John H. Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies. New York ; London: McGraw-Hill, 2000.

Dyfyniad MLA

Lau, John H. Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies. McGraw-Hill, 2000.

Rhybudd: Mae'n bosib nad yw'r dyfyniadau hyn bob amser yn 100% cywir.