Area array packaging processes for BGA, Flip Chip, and CSP /

Area array packaging processes for BGA, Flip Chip, and CSP /

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Detalles Bibliográficos
Outros autores: Gilleo, Ken
Formato: Libro
Idioma:English
Publicado: New York ; London : McGraw-Hill, c2004.
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics)
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