Area array packaging processes for BGA, Flip Chip, and CSP /

Eitemau Tebyg

• Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
  gan: Lau, John H.
  Cyhoeddwyd: (2000)
• Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
  Cyhoeddwyd: (1996)
• Microelectronics packaging handbook /
  Cyhoeddwyd: (1997)
• Routing in the third dimension : from VLSI chips to MCMs /
  gan: Sherwani, N. A. (Naveed A.)
  Cyhoeddwyd: (1995)
• Thermal management handbook : for electronic assemblies /
  gan: Sergent, Jerry E.
  Cyhoeddwyd: (1998)