Area array packaging processes for BGA, Flip Chip, and CSP /
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| 其他作者: | |
|---|---|
| 格式: | 图书 |
| 语言: | English |
| 出版: |
New York ; London :
McGraw-Hill,
c2004.
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| 主题: | |
| 在线阅读: | Contributor biographical information Table of contents Publisher description |
书本目录:
- Machine derived contents note: Introduction
- Next Generation Flip Chip Materials and Processes
- Concepts
- Cost Analysis
- High-Throughput FC Processing Using No-Flow Analysis
- Wafer-Level FC Processing
- Analysis of Next Generation FC Processes
- Compression Flow Placement Model & Analysis
- Modeling and Analysis of Chip Floating
- Flip Chip Assembly and Underfilling
- Process Overview
- Substrate Design
- Assembly with Capillary Flow Underfill
- Assembly with Fluxing Underfills
- Water-Applied Underfills
- Reliability
- BGA and CSP Rework
- Rework Process Considerations
- Basic Network Setups
- Identification of Process Yield Problems
- Component Reballing Considerations
- Analysis Using X-Ray Inspection
- BGA Assembly Reliability
- BGA and QFP Comparison
- BGA Thermal Cycling
- CBGA Failure Mechanisms
- PBGA Failure Mechanisms
- Shock and Thermal Cycling
- BGA Conclusions for Quality and Reliability Programs
- Die Attach and Rework
- Polymer Basics
- Die-Attach Materials
- Die-Attach Application Methods
- Applications
- Properties
- Reliability
- Rework
- Liquid Encapsulation Equipment and Processes
- Encapsulation Materials
- Encapsulation Methods
- Platform Design and Construction
- Dispensing Head
- Needles
- Pumps
- System Control
- Molding for Area Array Packages
- Molding Materials
- Transfer Molding Equipment
- Molding Processes
- Tooling
- Productivity and Cost
- Reliability
- References
- Contributors and Affiliations.