Area array packaging processes for BGA, Flip Chip, and CSP /
Saved in:
| Other Authors: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York ; London :
McGraw-Hill,
c2004.
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| Subjects: | |
| Online Access: | Contributor biographical information Table of contents Publisher description |
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| 040 | |a DLC |b eng |c DLC |d Uk | ||
| 042 | |a ukblsr | ||
| 050 | 0 | 0 | |a TK7874 |b .A72 2004 |
| 082 | 0 | 4 | |a 621.381046 |2 22 |
| 245 | 0 | 0 | |a Area array packaging processes for BGA, Flip Chip, and CSP / |c Ken Gilleo, editor. |
| 260 | |a New York ; |a London : |b McGraw-Hill, |c c2004. | ||
| 300 | |a x, 260 p. : |b ill. ; |c 25 cm. | ||
| 500 | |a Formerly CIP. |5 Uk | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | 0 | |a Machine derived contents note: Introduction -- Next Generation Flip Chip Materials and Processes -- Concepts -- Cost Analysis -- High-Throughput FC Processing Using No-Flow Analysis -- Wafer-Level FC Processing -- Analysis of Next Generation FC Processes -- Compression Flow Placement Model & Analysis -- Modeling and Analysis of Chip Floating -- Flip Chip Assembly and Underfilling -- Process Overview -- Substrate Design -- Assembly with Capillary Flow Underfill -- Assembly with Fluxing Underfills -- Water-Applied Underfills -- Reliability -- BGA and CSP Rework -- Rework Process Considerations -- Basic Network Setups -- Identification of Process Yield Problems -- Component Reballing Considerations -- Analysis Using X-Ray Inspection -- BGA Assembly Reliability -- BGA and QFP Comparison -- BGA Thermal Cycling -- CBGA Failure Mechanisms -- PBGA Failure Mechanisms -- Shock and Thermal Cycling -- BGA Conclusions for Quality and Reliability Programs -- Die Attach and Rework -- Polymer Basics -- Die-Attach Materials -- Die-Attach Application Methods -- Applications -- Properties -- Reliability -- Rework -- Liquid Encapsulation Equipment and Processes -- Encapsulation Materials -- Encapsulation Methods -- Platform Design and Construction -- Dispensing Head -- Needles -- Pumps -- System Control -- Molding for Area Array Packages -- Molding Materials -- Transfer Molding Equipment -- Molding Processes -- Tooling -- Productivity and Cost -- Reliability -- References -- Contributors and Affiliations. |
| 650 | 0 | |a Microelectronic packaging. | |
| 650 | 0 | |a Multichip modules (Microelectronics) | |
| 700 | 1 | |a Gilleo, Ken. | |
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| 856 | 4 | 1 | |3 Table of contents |u http://www.loc.gov/catdir/toc/mh041/2004042860.html |
| 856 | 4 | 2 | |3 Publisher description |u http://www.loc.gov/catdir/description/mh051/2004042860.html |
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