Area array packaging processes for BGA, Flip Chip, and CSP /
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| Other Authors: | |
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| Format: | Book |
| Language: | English |
| Published: |
New York ; London :
McGraw-Hill,
c2004.
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| Subjects: | |
| Online Access: | Contributor biographical information Table of contents Publisher description |
| Item Description: | Formerly CIP. |
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| Physical Description: | x, 260 p. : ill. ; 25 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 0071428291 (acid-free paper) |