Area array packaging processes for BGA, Flip Chip, and CSP /
Saved in:
| Andre forfattere: | |
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| Format: | Bog |
| Sprog: | English |
| Udgivet: |
New York ; London :
McGraw-Hill,
c2004.
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| Fag: | |
| Online adgang: | Contributor biographical information Table of contents Publisher description |
| Emne beskrivelse: | Formerly CIP. |
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| Fysisk beskrivelse: | x, 260 p. : ill. ; 25 cm. |
| Bibliografi: | Includes bibliographical references and index. |
| ISBN: | 0071428291 (acid-free paper) |