Cita APA (7a ed.)

Gilleo, K. (2004). Area array packaging processes for BGA, Flip Chip, and CSP. McGraw-Hill.

Cita Chicago Style (17a ed.)

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. New York ; London: McGraw-Hill, 2004.

Cita MLA (8a ed.)

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. McGraw-Hill, 2004.