APA-Zitierstil (7. Ausg.)

Gilleo, K. (2004). Area array packaging processes for BGA, Flip Chip, and CSP. McGraw-Hill.

Chicago-Zitierstil (17. Ausg.)

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. New York ; London: McGraw-Hill, 2004.

MLA-Zitierstil (8. Ausg.)

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. McGraw-Hill, 2004.