Cita APA (7th ed.)

Gilleo, K. (2004). Area array packaging processes for BGA, Flip Chip, and CSP. McGraw-Hill.

Cita Chicago (17th ed.)

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. New York ; London: McGraw-Hill, 2004.

Cita MLA (8th ed.)

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. McGraw-Hill, 2004.