APA (7th ed.) Citation

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition, Ume, C., & Yeh, C. (1996). Sensing, modeling, and simulation in emerging electronic packaging: Presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia. American Society of Mechanical Engineers.

Chicago Style (17th ed.) Citation

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition, Charles Ume, and Chao-pin Yeh. Sensing, Modeling, and Simulation in Emerging Electronic Packaging: Presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia. New York, N.Y.: American Society of Mechanical Engineers, 1996.

MLA (8th ed.) Citation

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, et al. Sensing, Modeling, and Simulation in Emerging Electronic Packaging: Presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia. American Society of Mechanical Engineers, 1996.