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| LEADER |
01738cam a2200373 a 4500 |
| 001 |
c000291348 |
| 003 |
CARM |
| 005 |
20090501104050.0 |
| 008 |
961023s1996 nyua b 101 0 eng d |
| 010 |
|
|
|a 96079040
|
| 019 |
1 |
|
|a 13393662
|5 LACONCORD2021
|
| 020 |
|
|
|a 0791815536
|
| 035 |
|
|
|a (OCoLC)36245397
|5 LACONCORD2021
|
| 040 |
|
|
|a LC
|b eng
|c LC
|d LC
|d VCAV
|
| 042 |
|
|
|a lccopycat
|
| 050 |
0 |
4 |
|a TK7870.25
|b .A64 1996
|
| 082 |
0 |
4 |
|a 621.3810
|
| 245 |
0 |
0 |
|a Application of CAE/CAD to electronic systems :
|b presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
|c sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].
|
| 260 |
|
|
|a New York, N.Y. :
|b American Society of Mechanical Engineers,
|c c1996.
|
| 300 |
|
|
|a v, 123 p. :
|b ill. ;
|c 28 cm.
|
| 490 |
1 |
|
|a EEP ;
|v vol. 18
|
| 504 |
|
|
|a Includes bibliographical references and index.
|
| 650 |
|
0 |
|a Electronic packaging
|x Cooling
|v Congresses.
|
| 650 |
|
0 |
|a Heat sinks (Electronics)
|v Congresses.
|
| 650 |
|
0 |
|a CAD/CAM systems
|v Congresses.
|
| 650 |
|
0 |
|a Computer-aided engineering
|v Congresses.
|
| 650 |
|
0 |
|a Computer-aided design
|v Congresses.
|
| 700 |
1 |
|
|a Agonafer, D.
|
| 710 |
2 |
|
|a American Society of Mechanical Engineers.
|b Electrical and Electronic Packaging Division.
|
| 711 |
2 |
|
|a International Mechanical Engineering Congress and Exposition
|d (1996 :
|c Atlanta, Ga.)
|
| 830 |
|
0 |
|a EEP (Series) ;
|v vol. 18.
|
| 852 |
8 |
|
|b CARM
|h A3:AE24C0
|i F06320
|p 0527309
|f BK
|
| 999 |
f |
f |
|i 9572a2eb-f6cf-5111-9369-fa990d7ae0be
|s 846487c7-f6c7-5afe-99d3-c4ee99038cf3
|
| 952 |
f |
f |
|p Can circulate
|a CAVAL
|b CAVAL
|c CAVAL
|d CARM 1 Store
|e F06320
|f A3:AE24C0
|h Other scheme
|i book
|m 0527309
|