Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /

Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /

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التفاصيل البيبلوغرافية
مؤلفون مشاركون: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition
مؤلفون آخرون: Agonafer, D.
التنسيق: وقائع المؤتمر كتاب
اللغة:English
منشور في: New York, N.Y. : American Society of Mechanical Engineers, c1996.
سلاسل:EEP (Series) ; vol. 18.
الموضوعات:
Electronic packaging > Cooling > Congresses.
Heat sinks (Electronics) > Congresses.
CAD/CAM systems > Congresses.
Computer-aided engineering > Congresses.
Computer-aided design > Congresses.
الوصف
وصف مادي:v, 123 p. : ill. ; 28 cm.
بيبلوغرافيا:Includes bibliographical references and index.
ردمك:0791815536

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