Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /

Saved in:
書目詳細資料
Corporate Authors: ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers
其他作者: Chen, William T., Engel, Peter A.
格式: Conference Proceeding 圖書
語言:English
出版: New York : American Society of Mechanical Engineers, c1993.
叢編:EEP (Series) ; vol. 4.
主題:

CARM 1 Store

持有資料詳情 CARM 1 Store
索引號: A3:AE23C0 F06317
A3:AE24C0 F06320
復印件 1 可用  預訂
復印件 2 可用  預訂