Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Bewaard in:
Coauteurs: | , |
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Andere auteurs: | , |
Formaat: | Conferentie akten Boek |
Taal: | English |
Gepubliceerd in: |
New York :
American Society of Mechanical Engineers,
c1993.
|
Reeks: | EEP (Series) ;
vol. 4. |
Onderwerpen: |
Inhoudsopgave:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.