Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
محفوظ في:
| مؤلفون مشاركون: | , |
|---|---|
| مؤلفون آخرون: | , |
| التنسيق: | وقائع المؤتمر كتاب |
| اللغة: | English |
| منشور في: |
New York :
American Society of Mechanical Engineers,
c1993.
|
| سلاسل: | EEP (Series) ;
vol. 4. |
| الموضوعات: |
جدول المحتويات:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.