Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /

Збережено в:
Бібліографічні деталі
Співавтори: ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers
Інші автори: Chen, William T., Engel, Peter A.
Формат: Матеріали конференцій Книга
Мова:English
Опубліковано: New York : American Society of Mechanical Engineers, c1993.
Серія:EEP (Series) ; vol. 4.
Предмети:
Зміст:
  • v. 1. Structural analysis, materials and processes, design, reliability
  • v. 2. Thermal management, solder technology, optoelectronics packaging.