Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /

שמור ב:
מידע ביבליוגרפי
Corporate Authors: ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers
מחברים אחרים: Chen, William T., Engel, Peter A.
פורמט: Conference Proceeding ספר
שפה:English
יצא לאור: New York : American Society of Mechanical Engineers, c1993.
סדרה:EEP (Series) ; vol. 4.
נושאים:
תוכן הענינים:
  • v. 1. Structural analysis, materials and processes, design, reliability
  • v. 2. Thermal management, solder technology, optoelectronics packaging.