Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Gespeichert in:
Körperschaften: | , |
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Weitere Verfasser: | , |
Format: | Tagungsbericht Buch |
Sprache: | English |
Veröffentlicht: |
New York :
American Society of Mechanical Engineers,
c1993.
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Schriftenreihe: | EEP (Series) ;
vol. 4. |
Schlagworte: |
Inhaltsangabe:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.