Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /

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Bibliographische Detailangaben
Körperschaften: ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers
Weitere Verfasser: Chen, William T., Engel, Peter A.
Format: Tagungsbericht Buch
Sprache:English
Veröffentlicht: New York : American Society of Mechanical Engineers, c1993.
Schriftenreihe:EEP (Series) ; vol. 4.
Schlagworte:
Inhaltsangabe:
  • v. 1. Structural analysis, materials and processes, design, reliability
  • v. 2. Thermal management, solder technology, optoelectronics packaging.