Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
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Corporate Authors: | , |
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Other Authors: | , |
Format: | Conference Proceeding Book |
Language: | English |
Published: |
New York :
American Society of Mechanical Engineers,
c1993.
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Series: | EEP (Series) ;
vol. 4. |
Subjects: |
Physical Description: | 2 v. (xi, 1200 p.) : ill. ; 28 cm. |
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Bibliography: | Includes bibliographical references and indexes. |
ISBN: | 0791806863 (set) |