Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /
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企业作者: | , , |
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其他作者: | , , |
格式: | 会议录 图书 |
语言: | English |
出版: |
New York, N.Y :
American Society of Mechanical Engineers,
c1995.
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丛编: | EEP (Series) ;
vol. 10. |
主题: |